IP Library › Granted Patent US 6,498,074
Granted Patent Utility
US 6,498,074 · App. 09/876,888

Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners

Inventors: Oleg Siniaguine, Patrick B. Halahan, Sergey Savastiouk
Patented Case View Patent ↗
Granted: Dec 24, 2002 Filed: Jun 6, 2001
Inventors
Oleg Siniaguine
Patrick B. Halahan
Sergey Savastiouk
Assignee (at issue)
Tru-Si Technologies, Inc.

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Quick Facts
Patent No.
US 6,498,074
App. No.
09/876,888
Filed
2001-06-06
Granted
2002-12-24
Kind
B2