Granted Patent
Utility
US 6,503,433 · App. 09/827,607
Liquid transfer molding system for encapsulating semiconductor integrated circuits
Inventor:
Haryanto Chandra
Patented Case
View Patent ↗
Granted: Jan 7, 2003
Filed: Apr 6, 2001
Inventor
Haryanto Chandra
Assignee (at issue)
Infineon Technologies North America Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.