Granted Patent
Utility
US 6,503,780 · App. 09/610,309
Wafer scale image sensor package fabrication method
Inventors:
Thomas P. Glenn, Steven Webster, Tony Arellano
Patented Case
View Patent ↗
Granted: Jan 7, 2003
Filed: Jul 5, 2000
Inventors
Thomas P. Glenn
Steven Webster
Tony Arellano
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.