Granted Patent
Utility
US 6,503,835 · App. 09/939,606
Method of making an organic copper diffusion barrier layer
Inventor:
Shyh-Dar Lee
Patented Case
View Patent ↗
Granted: Jan 7, 2003
Filed: Aug 28, 2001
Inventor
Shyh-Dar Lee
Assignee (at issue)
Silicon Integrated Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.