IP Library Granted Patent US 6,506,647
Granted Patent Utility
US 6,506,647 · App. 09/961,059

Method for fabricating a semiconductor integrated circuit device

Inventors: Kenichi Kuroda, Kozo Watanabe
Patented Case View Patent ↗
Granted: Jan 14, 2003 Filed: Sep 24, 2001
Inventors
Kenichi Kuroda
Kozo Watanabe
Assignee (at issue)
HITACHI, LTD.

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Quick Facts
Patent No.
US 6,506,647
App. No.
09/961,059
Filed
2001-09-24
Granted
2003-01-14
Kind
B2