Granted Patent
Utility
US 6,506,679 · App. 09/942,181
Deadhesion method and mechanism for wafer processing
Inventors:
Guy T. Blalock, Hugh E. Stroupe, Brian F. Gordon
Patented Case
View Patent ↗
Granted: Jan 14, 2003
Filed: Aug 29, 2001
Inventors
Guy T. Blalock
Hugh E. Stroupe
Brian F. Gordon
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.