Granted Patent
Utility
US 6,507,102 · App. 10/006,642
Printed circuit board with integral heat sink for semiconductor package
Inventors:
Frank J. Juskey, John R. McMillan, Ronald Patrick Huemoeller
Patented Case
View Patent ↗
Granted: Jan 14, 2003
Filed: Dec 5, 2001
Inventors
Frank J. Juskey
John R. McMillan
Ronald Patrick Huemoeller
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.