IP Library › Granted Patent US 6,507,114
Granted Patent Utility
US 6,507,114 · App. 09/774,130

BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die

Inventors: Chong Chin Hui, Lee Choon Kuan, Lee Kian Chai
Patented Case View Patent ↗
Granted: Jan 14, 2003 Filed: Jan 30, 2001
Inventors
Chong Chin Hui
Lee Choon Kuan
Lee Kian Chai
Assignee (at issue)
Micron Technology, Inc.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,507,114
App. No.
09/774,130
Filed
2001-01-30
Granted
2003-01-14
Kind
B2