Granted Patent
Utility
US 6,509,256 · App. 09/515,555
Methods of forming electrically conductive interconnections and electrically interconnected substrates
Inventors:
Curtis M. Medlen, Mark E. Tuttle
Patented Case
View Patent ↗
Granted: Jan 21, 2003
Filed: Feb 29, 2000
Inventors
Curtis M. Medlen
Mark E. Tuttle
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.