Granted Patent
Utility
US 6,509,637 · App. 10/094,731
Low profile mounting of thick integrated circuit packages within low-profile circuit modules
Inventor:
Markus K. Liebhard
Patented Case
View Patent ↗
Granted: Jan 21, 2003
Filed: Mar 8, 2002
Inventor
Markus K. Liebhard
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.