Granted Patent
Utility
US 6,509,638 · App. 09/946,363
Semiconductor device having a plurality of stacked semiconductor chips on a wiring board
Inventors:
Hiroaki Fujimoto, Yoshinobu Kunitomo, Takashi Yui
Patented Case
View Patent ↗
Granted: Jan 21, 2003
Filed: Sep 6, 2001
Inventors
Hiroaki Fujimoto
Yoshinobu Kunitomo
Takashi Yui
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.