IP Library Granted Patent US 6,512,265
Granted Patent Utility
US 6,512,265 · App. 10/106,364

Method of fabricating semiconductor device

Inventors: Sumito Numazawa, Yoshito Nakazawa, Masayoshi Kobayashi, Satoshi Kudo, Yasuo Imai, Sakae Kubo, Takashi Shigematsu, Akihiro Ohnishi, Kozo Uesawa, Kentaro Oishi
Patented Case View Patent ↗
Granted: Jan 28, 2003 Filed: Mar 27, 2002
Inventors
Sumito Numazawa
Yoshito Nakazawa
Masayoshi Kobayashi
Satoshi Kudo
Yasuo Imai
Sakae Kubo
Takashi Shigematsu
Akihiro Ohnishi
Kozo Uesawa
Kentaro Oishi
Assignees (at issue)
HITACHI, LTD.
Hitachi Ulsi Systems Co., Ltd.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,512,265
App. No.
10/106,364
Filed
2002-03-27
Granted
2003-01-28
Kind
B2