Granted Patent
Utility
US 6,514,130 · App. 10/096,540
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
Inventor:
Scott E. Moore
Patented Case
View Patent ↗
Granted: Feb 4, 2003
Filed: Mar 12, 2002
Inventor
Scott E. Moore
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.