IP Library › Granted Patent US 6,514,835
Granted Patent Utility
US 6,514,835 · App. 09/676,283

Stress control of thin films by mechanical deformation of wafer substrate

Inventors: Bryan C. Hendrix, Jeffrey F. Roeder, Steven M. Bilodeau
Patented Case View Patent ↗
Granted: Feb 4, 2003 Filed: Sep 28, 2000
Inventors
Bryan C. Hendrix
Jeffrey F. Roeder
Steven M. Bilodeau
Assignee (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.

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Quick Facts
Patent No.
US 6,514,835
App. No.
09/676,283
Filed
2000-09-28
Granted
2003-02-04
Kind
B1