Granted Patent
Utility
US 6,514,860 · App. 09/892,750
Integration of organic fill for dual damascene process
Inventors:
Lynne A. Okada, Fei Wang, James Kai
Patented Case
View Patent ↗
Granted: Feb 4, 2003
Filed: Jun 28, 2001
Inventors
Lynne A. Okada
Fei Wang
James Kai
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.