Granted Patent
Utility
US 6,514,862 · App. 09/977,239
Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same
Inventors:
Jae-Dong Lee, Jong Won Lee, Bo-Un Yoon, Sang-rok Hah
Patented Case
View Patent ↗
Granted: Feb 4, 2003
Filed: Oct 16, 2001
Inventors
Jae-Dong Lee
Jong Won Lee
Bo-Un Yoon
Sang-rok Hah
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.