Granted Patent
Utility
US 6,517,656 · App. 09/412,889
Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method
Inventor:
Vincent DiCaprio
Patented Case
View Patent ↗
Granted: Feb 11, 2003
Filed: Oct 5, 1999
Inventor
Vincent DiCaprio
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.