IP Library › Granted Patent US 6,518,655
Granted Patent Utility
US 6,518,655 · App. 09/975,198

Multi-chip package-type semiconductor device

Inventors: Yuichi Morinaga, Kiyoshi Hasegawa, Kenji Fuchinoue
Patented Case View Patent ↗
Granted: Feb 11, 2003 Filed: Oct 12, 2001
Inventors
Yuichi Morinaga
Kiyoshi Hasegawa
Kenji Fuchinoue
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.

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Quick Facts
Patent No.
US 6,518,655
App. No.
09/975,198
Filed
2001-10-12
Granted
2003-02-11
Kind
B2