Granted Patent
Utility
US 6,519,045 · App. 09/772,901
Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
Inventor:
Daewon Kwon
Patented Case
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Granted: Feb 11, 2003
Filed: Jan 31, 2001
Inventor
Daewon Kwon
Assignee (at issue)
Rudolph Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.