Granted Patent
Utility
US 6,520,821 · App. 09/310,326
Device package and device encapsulation method
Inventors:
Ikuko Ishii, Yoshikazu Sakaguchi
Patented Case
View Patent ↗
Granted: Feb 18, 2003
Filed: May 12, 1999
Inventors
Ikuko Ishii
Yoshikazu Sakaguchi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.