Granted Patent
Utility
US 6,521,138 · App. 09/873,157
Method for measuring width of bottom under cut during etching process
Inventors:
Hung-Chieh Chen, Chun-Yen Chen
Patented Case
View Patent ↗
Granted: Feb 18, 2003
Filed: Jun 1, 2001
Inventors
Hung-Chieh Chen
Chun-Yen Chen
Assignee (at issue)
Silicon Integrated Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.