Granted Patent
Utility
US 6,521,979 · App. 09/324,780
Member for semiconductor package and semiconductor package using the same, and fabrication method thereof
Inventor:
Joong-Ha You
Patented Case
View Patent ↗
Granted: Feb 18, 2003
Filed: Jun 3, 1999
Inventor
Joong-Ha You
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.