Granted Patent
Utility
US 6,521,982 · App. 09/587,136
Packaging high power integrated circuit devices
Inventors:
Sean T. Crowley, Blake A. Gillett, Bradley D. Boland
Patented Case
View Patent ↗
Granted: Feb 18, 2003
Filed: Jun 2, 2000
Inventors
Sean T. Crowley
Blake A. Gillett
Bradley D. Boland
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.