Granted Patent
Utility
US 6,521,987 · App. 09/703,195
Plastic integrated circuit device package and method for making the package
Inventors:
Thomas P. Glenn, Scott Joseph Jewler, David Roman, Jae Hak Yee, Doo Hwan Moon
Patented Case
View Patent ↗
Granted: Feb 18, 2003
Filed: Oct 31, 2000
Inventors
Thomas P. Glenn
Scott Joseph Jewler
David Roman
Jae Hak Yee
Doo Hwan Moon
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.