Granted Patent
Utility
US 6,521,995 · App. 09/409,536
Wafer-level package
Inventors:
Salman Akram, Alan G. Wood
Patented Case
View Patent ↗
Granted: Feb 18, 2003
Filed: Sep 30, 1999
Inventors
Salman Akram
Alan G. Wood
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.