IP Library Granted Patent US 6,524,645
Granted Patent Utility
US 6,524,645 · App. 08/324,842

Process for the electroless deposition of metal on a substrate

Inventors: Michael D. Evans, Tae-Yong Kim, Henry Law, Te-Sung Wu
Patented Case View Patent ↗
Granted: Feb 25, 2003 Filed: Oct 18, 1994
Inventors
Michael D. Evans
Tae-Yong Kim
Henry Law
Te-Sung Wu
Assignee (at issue)
Agere Systems Inc.

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Quick Facts
Patent No.
US 6,524,645
App. No.
08/324,842
Filed
1994-10-18
Granted
2003-02-25
Kind
B1