Granted Patent
Utility
US 6,524,892 · App. 09/707,957
Method of fabricating multilayer flexible wiring boards
Inventors:
Soichiro Kishimoto, Hiroyuki Hishinuma
Patented Case
View Patent ↗
Granted: Feb 25, 2003
Filed: Nov 8, 2000
Inventors
Soichiro Kishimoto
Hiroyuki Hishinuma
Assignee (at issue)
Sony Chemicals Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.