Granted Patent
Utility
US 6,524,942 · App. 10/056,004
Bond pad structure and its method of fabricating
Inventors:
Chen-Wen Tsai, Chung-Ju Wu, Wei-Feng Lin
Patented Case
View Patent ↗
Granted: Feb 25, 2003
Filed: Jan 28, 2002
Inventors
Chen-Wen Tsai
Chung-Ju Wu
Wei-Feng Lin
Assignee (at issue)
Silicon Integrated Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.