Granted Patent
Utility
US 6,525,409 · App. 09/644,695
CCD mold package with improved heat radiation structure
Inventor:
Nobuyuki Matsuo
Patented Case
View Patent ↗
Granted: Feb 25, 2003
Filed: Aug 24, 2000
Inventor
Nobuyuki Matsuo
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.