IP Library Granted Patent US 6,525,416
Granted Patent Utility
US 6,525,416 · App. 09/970,979

Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them

Inventors: Christian Hauser, Johann Winderl, Martin Reiss
Patented Case View Patent ↗
Granted: Feb 25, 2003 Filed: Oct 4, 2001
Inventors
Christian Hauser
Johann Winderl
Martin Reiss
Assignee (at issue)
Infineon Technologies AG

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Quick Facts
Patent No.
US 6,525,416
App. No.
09/970,979
Filed
2001-10-04
Granted
2003-02-25
Kind
B2