Granted Patent
Utility
US 6,525,420 · App. 09/774,475
Semiconductor package with lid heat spreader
Inventors:
Jon Zuo, Donald M. Ernst
Patented Case
View Patent ↗
Granted: Feb 25, 2003
Filed: Jan 30, 2001
Inventors
Jon Zuo
Donald M. Ernst
Assignee (at issue)
Thermal Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.