Granted Patent
Utility
US 6,525,421 · App. 09/846,080
Molded integrated circuit package
Inventors:
Chok J. Chia, Seng-Sooi Lim, Wee Liew
Patented Case
View Patent ↗
Granted: Feb 25, 2003
Filed: May 1, 2001
Inventors
Chok J. Chia
Seng-Sooi Lim
Wee Liew
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.