Granted Patent
Utility
US 6,528,736 · App. 08/786,494
Multi-layer printed circuit board and method of making same
Inventors:
Daniel Phillip Dailey, Robert Edward Belke, Jay DeAvis Baker, Achyuta Achari, Myron Lemecha, Michael George Todd
Patented Case
View Patent ↗
Granted: Mar 4, 2003
Filed: Jan 21, 1997
Inventors
Daniel Phillip Dailey
Robert Edward Belke
Jay DeAvis Baker
Achyuta Achari
Myron Lemecha
Michael George Todd
Assignee (at issue)
Visteon Global Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.