Granted Patent
Utility
US 6,528,875 · App. 09/839,305
Vacuum sealed package for semiconductor chip
Inventors:
Thomas P. Glenn, Roy Dale Hollaway, Steven Webster
Patented Case
View Patent ↗
Granted: Mar 4, 2003
Filed: Apr 20, 2001
Inventors
Thomas P. Glenn
Roy Dale Hollaway
Steven Webster
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.