Granted Patent
Utility
US 6,528,880 · App. 09/892,128
Semiconductor package for power JFET having copper plate for source and ribbon contact for gate
Inventor:
Bill Planey
Patented Case
View Patent ↗
Granted: Mar 4, 2003
Filed: Jun 25, 2001
Inventor
Bill Planey
Assignee (at issue)
Lovoltech, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.