Granted Patent
Utility
US 6,530,764 · App. 09/770,666
Mold for resin-sealing of semiconductor devices
Inventors:
Yoshiyuki Mishima, Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno, Kiyoharu Kato
Patented Case
View Patent ↗
Granted: Mar 11, 2003
Filed: Jan 29, 2001
Inventors
Yoshiyuki Mishima
Tetsuya Hirose
Hideji Aoki
Hiromichi Yamada
Toru Ueno
Kiyoharu Kato
Assignee (at issue)
MITSUBISHI ELECTRIC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.