Granted Patent
Utility
US 6,531,378 · App. 09/968,576
Method for processing wafer by applying layer to protect the backside during a tempering step and removing contaminated portions of the layer
Inventor:
Joachim Hopfner
Patented Case
View Patent ↗
Granted: Mar 11, 2003
Filed: Oct 1, 2001
Inventor
Joachim Hopfner
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.