Granted Patent
Utility
US 6,531,384 · App. 09/952,527
Method of forming a bond pad and structure thereof
Inventors:
Thomas S. Kobayashi, Scott K. Pozder
Patented Case
View Patent ↗
Granted: Mar 11, 2003
Filed: Sep 14, 2001
Inventors
Thomas S. Kobayashi
Scott K. Pozder
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.