Granted Patent
Utility
US 6,531,387 · App. 10/174,431
Polishing of conductive layers in fabrication of integrated circuits
Inventor:
Kuo-Chun Wu
Patented Case
View Patent ↗
Granted: Mar 11, 2003
Filed: Jun 17, 2002
Inventor
Kuo-Chun Wu
Assignee (at issue)
MOSEL VITELIC INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.