Granted Patent
Utility
US 6,531,771 · App. 09/890,602
Dissipation of heat from a circuit board having bare silicon chips mounted thereon
Inventors:
Paul Schoenstein, Benjamin L. Sitler, Robert H. Reamey, Christine E. Vogdes
Patented Case
View Patent ↗
Granted: Mar 11, 2003
Filed: Nov 6, 2001
Inventors
Paul Schoenstein
Benjamin L. Sitler
Robert H. Reamey
Christine E. Vogdes
Assignee (at issue)
Tyco Electronics Co., Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.