Granted Patent
Utility
US 6,534,338 · App. 09/895,767
Method for molding semiconductor package having a ceramic substrate
Inventors:
Ronald James Schoonejongen, Frank J. Juskey, Anthony James LoBianco
Patented Case
View Patent ↗
Granted: Mar 18, 2003
Filed: Jun 29, 2001
Inventors
Ronald James Schoonejongen
Frank J. Juskey
Anthony James LoBianco
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.