Granted Patent
Utility
US 6,534,345 · App. 09/514,265
Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method
Inventors:
Simon Muff, Jens Pohl, Johann Winderl
Patented Case
View Patent ↗
Granted: Mar 18, 2003
Filed: Feb 28, 2000
Inventors
Simon Muff
Jens Pohl
Johann Winderl
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.