Granted Patent
Utility
US 6,534,792 · App. 09/573,249
Microelectronic device structure with metallic interlayer between substrate and die
Inventor:
Christopher P. Schaffer
Patented Case
View Patent ↗
Granted: Mar 18, 2003
Filed: May 18, 2000
Inventor
Christopher P. Schaffer
Assignee (at issue)
The Boeing Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.