Granted Patent
Utility
US 6,534,859 · App. 10/116,983
Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
Inventors:
Il Kwon Shim, Seng Guan Chow, Gerry Balanon
Patented Case
View Patent ↗
Granted: Mar 18, 2003
Filed: Apr 5, 2002
Inventors
Il Kwon Shim
Seng Guan Chow
Gerry Balanon
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.