Granted Patent
Utility
US 6,535,004 · App. 10/140,572
Testing of BGA and other CSP packages using probing techniques
Inventors:
Rajiv Mehta, Liop-Jin Yap, Raymundo M. Camenforte, Chee Keong Tan
Patented Case
View Patent ↗
Granted: Mar 18, 2003
Filed: May 8, 2002
Inventors
Rajiv Mehta
Liop-Jin Yap
Raymundo M. Camenforte
Chee Keong Tan
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.