Granted Patent
Utility
US 6,535,009 · App. 09/553,126
Configuration for carrying out burn-in processing operations of semiconductor devices at wafer level
Inventor:
Peter Pöchmüller
Patented Case
View Patent ↗
Granted: Mar 18, 2003
Filed: Apr 19, 2000
Inventor
Peter Pöchmüller
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.