Granted Patent
Utility
US 6,537,848 · App. 09/867,095
Super thin/super thermal ball grid array package
Inventors:
Raymundo M. Camenforte, Dioscoro A. Merilo, Seng Guan Chow
Patented Case
View Patent ↗
Granted: Mar 25, 2003
Filed: May 30, 2001
Inventors
Raymundo M. Camenforte
Dioscoro A. Merilo
Seng Guan Chow
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.