Granted Patent
Utility
US 6,537,870 · App. 09/675,432
Method of forming an integrated circuit comprising a self aligned trench
Inventor:
Hua Shen
Patented Case
View Patent ↗
Granted: Mar 25, 2003
Filed: Sep 29, 2000
Inventor
Hua Shen
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.