Granted Patent
Utility
US 6,541,730 · App. 09/978,040
Method and apparatus for cutting a non-metal substrate by using a laser beam
Inventors:
Hyung-Woo Nam, Dae-Ho Choo, Baek-Kyun Jeon
Patented Case
View Patent ↗
Granted: Apr 1, 2003
Filed: Oct 17, 2001
Inventors
Hyung-Woo Nam
Dae-Ho Choo
Baek-Kyun Jeon
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.