Granted Patent
Utility
US 6,541,871 · App. 10/098,516
Method for fabricating a stacked chip package
Inventors:
Tsung-Ming Pai, Chung-Hao Lee, Pao-Hei Chang Chin, Meng-Hui Lin, Song Wang
Patented Case
View Patent ↗
Granted: Apr 1, 2003
Filed: Mar 18, 2002
Inventors
Tsung-Ming Pai
Chung-Hao Lee
Pao-Hei Chang Chin
Meng-Hui Lin
Song Wang
Assignee (at issue)
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.